华虹公司:港股公告:截至二零二四年六月三十日止六个月中期业绩公告

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。
HUA HONG SEMICONDUCTOR LIMITED
華虹半導體有限公司
（於香港註冊成立之有限公司）
（股份代號：01347）
截至二零二四年六月三十日止六個月
中期業績公告
華虹半導體有限公司（「本公司」）董事會（「董事會」）謹此公佈本公司及其子公司 截至二零二四年六月三十日止六個月的未經審核綜合業績。
本公告載列本公司二零二四年中期報告全文，並符合香港聯合交易所有限公司（「香港聯交所」）證券上市規則有關中期業績初步公告附載資料之相關規定。
本公司二零二四年中期報告的印刷版本將於適當時候寄發予本公司股東，並可於 香港聯交所網站www.hkexnews.hk及本公司網站www.huahonggrace.com進行查 閱。
承董事會命
華虹半導體有限公司
董事長兼執行董事
張素心先生
中國上海，二零二四年八月二十九日
於本公告日期，本公司董事分別為：
執行董事：
張素心（董事長）
唐均君（總裁）
非執行董事：
葉峻
孫國棟
周利民
熊承艷
獨立非執行董事：
張祖同
王桂壎太平紳士
封松林

DEFINITIONS
In this interim report, unless the context otherwise requires, the following terms shall have the meanings set out below.
“Board” the board of Directors of the Company;
“China” or “the PRC” the People’s Republic of China, but for the purpose of this interim report and
for geographical reference only, except where the context otherwise requires,
references in this interim report to “China” and the “PRC” do not include Taiwan, the
Macau Special Administrative Region and Hong Kong;
“Company” or “our Company” Hua Hong Semiconductor Limited, a company incorporated in Hong Kong with
limited liability on 21 January 2005 and, except where the context otherwise
requires, all of its subsidiaries, or its present subsidiaries where the context refers
to the time before it became the holding company of its present subsidiaries;
“Company Secretary” the company secretary of the Company;
“Director(s)” the director(s) of the Company;
“EPS” earnings per share;
“Executive Director(s)” the executive Director(s) of our Company;
“Group” our Company and our subsidiaries or, where the context so requires, the
businesses operated by our subsidiaries or their predecessors (as the case may
be) with respect to the period before our Company became the holding company of
our present subsidiaries (or became associated companies of our Company);
“HHGrace” Shanghai Huahong Grace Semiconductor Manufacturing Corporation* (上海華虹宏
力半導體製造有限公司), a company incorporated in the PRC on 24 January 2013
and a wholly-owned subsidiary of the Company;
“Hua Hong Manufacturing” Hua Hong Semiconductor Manufacturing (Wuxi) Co., Ltd.* (華虹半導體製造(無錫)有
限公司), a company incorporated in the PRC on 17 June 2022 and held as to 51%
by the Group;
“HK$” Hong Kong dollars, the lawful currency of Hong Kong;
“Hong Kong” the Hong Kong Special Administrative Region of the PRC;
“Hong Kong Stock Exchange” The Stock Exchange of Hong Kong Limited;
“IC” Integrated Circuit;
“Independent Non-Executive the independent non-executive Director(s) of our Company;
Director(s)”
INTERIM REPORT 2024 1
DEFINITIONS
“Listing Rules” the Rules Governing the Listing of Securities on The Stock Exchange of Hong Kong
Limited, as amended or supplemented from time to time;
“Model Code” the Model Code for Securities Transactions by Directors of Listed Issuers as set out
in Appendix C3 to the Listing Rules;
“Non-Executive Director(s)” the non-executive Director(s) of our Company;
“RMB” Renminbi, the lawful currency of the PRC;
“RMB Share(s)” or “A Share(s)” the ordinary share(s) of the Company which are listed on the STAR Market and
traded in RMB;
“RMB Share Issue” the Company’s issue of 407,750,000 RMB Shares, which have been listed on the
STAR Market since 7 August 2023;
“SFO” the Securities and Futures Ordinance (Chapter 571 of the Laws of Hong Kong), as
amended or supplemented from time to time;
“Shanghai Stock Exchange” the Shanghai Stock Exchange;